Zhang Research Group

Zhang Research Group

We are interested in developing new mechanics theories and computational models of advanced materials and structures, devising novel mechanics-guided designs of hard/soft integrated systems with unprecedented properties, and exploring their versatile capabilities and functions in technologies, in particular on mechanically-guided 3D assembly, wearable and biointegrated electronics, and energy storage system.

Representative Publications

• Liu Z†, Hu X†, Bo R†, Yang Y, Cheng X, Pang W, Liu Q, Wang Y, Wang S, Xu S, Shen Z, Zhang YH*. A three-dimensionally architected electronic skin mimicking human mechanosensation. Science, 2024, 384: 987-994
• Cheng X†, Shen Z†, Zhang YH*. Bioinspired 3D flexible devices and functional systems. National Science Review, 2024, 11: nwad314
• Shen Z, Hu X, Tang Z, Xiao Y, Wang S, Cheng X*, Zhang YH*. Curvature Programming of Freestanding 3D Mesostructures and Flexible Electronics Based on Bilayer Ribbon Networks. Journal of the Mechanics and Physics of Solids, 2024, 191: 105766
• Cheng X†, Fan Z†, Yao S, Jin T, Lv Z, Lan Y, Bo R, Chen Y, Zhang F, Shen Z, Wan H, Huang Y, Zhang YH*. Programming 3D Curved Mesosurfaces using Microlattice Designs. Science, 2023, 379: 1225-1232
• Cao S†, Wei Y†, Bo R, Yun X, Xu S, Guan Y, Zhao J, Lan Y, Zhang B, Xiong Y, Jin T, Lai Y, Chang J, Zhao Q, Wei M, Shao Y, Quan Q*, Zhang YH*. Inversely engineered biomimetic flexible network scaffolds for soft tissue regeneration. Science Advances, 2023, 9: adi8606
• Bo R†, Xu S†, Yang Y†, Zhang YH*. Mechanically-guided 3D assembly for architected flexible electronics. Chemical Reviews, 2023, 123: 11137-11189
• Jin T, Cheng X, Xu S, Lai YC, Zhang YH*. Deep learning aided inverse design of the buckling-guided assembly for 3D frame structures. Journal of the Mechanics and Physics of Solids, 2023, 179: 105398
• Shuai Y†, Zhao J†, Bo R, Lan Y, Lv Z, Zhang YH*. A wrinkling-assisted strategy for controlled interface delamination in mechanically-guided 3D assembly. Journal of the Mechanics and Physics of Solids, 2023, 173: 105203
• Song H†, Luo G†, Ji Z, Bo R, Xue Z, Yan D, Zhang F, Bai K, Liu J, Cheng X, Pang W, Shen Z, Zhang YH*. Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials. Science Advances, 2022, 8: eabm3785
• Xue Z†, Jin T†, Xu S, Bai K, He Q, Zhang F, Cheng X, Ji Z, Pang W, Shen Z, Song H, Zhang YH*. Assembly of complex 3D structures and electronics on curved surfaces. Science Advances, 2022, 8: eabm6922
• Pang W†, Xu S†, Wu J, Bo R, Jin T, Xiao Y, Liu Z, Zhang F, Cheng X, Bai K, Song H, Xue Z, Wen L, Zhang YH*. A soft microrobot with highly-deformable 3D actuators for climbing and transitioning complex surfaces. PNAS, 2022, 119: e2215028119
• Han M†, Guo X†, Chen X†, Liang C, Zhao H, Zhang Q, Bai W, Zhang F, Wei H, Wu C, Cui Q, Yao S, Sun B, Yang Y, Yang Q, Wu C, Ma Y, Xue Z, Kwak JW, Jin T, Tu Q, Song E, Tian Z, Mei Y, Fang D, Zhang H, Huang Y*, Zhang YH*, Roger JA*. Sub-millimeter scale multi-material terrestrial robots. Science Robotics, 2022, 7: eabn0602
• Kim BH†, Li K†, Kim JT†, Park Y†, Jang H, Wang X, Xie Z, Won SM, Yoon HJ, Lee G, Jang WJ, Lee KH, Chung TS, Jung YH, Heo SY, Lee Y, Kim J, Cai T, Kim Y, Prasopsukh P, Yu Y, Yu X, Avila R, Luan H, Song H, Zhu F, Zhao Y, Chen L, Han SH, Kim J, Oh SJ, Lee H, Lee CH, Huang Y*, Chamorro LP*, Zhang YH*, Rogers JA*. Three-Dimensional Electronic Microfliers Inspired by Wind-Dispersed Seeds. Nature, 2021, 597: 503-510
• Cheng X, Zhang F, Bo R, Shen Z, Pang W, Jin T, Song H, Xue Z, Zhang YH*. An anti-fatigue design strategy for three-dimensional ribbon-shaped flexible electronics. Advanced Materials, 2021, 33: 2102684
• Liu J†, Yan D†, Pang W, Zhang YH*. Design, Fabrication and Applications of Soft Network Materials. Materials Today, 2021, 49: 324-350
• Zhang H, Wu J, Fang DN*, Zhang YH*. Hierarchical mechanical metamaterials built with scalable tristable elements for ternary logic operation and amplitude modulation. Science Advances, 2021, 7: eabf1966
• Wu J, Yao S, Zhang H, Man W, Bai Z, Zhang F, Wang X, Fang DN*, Zhang YH*. Liquid crystal elastomer metamaterials with giant biaxial thermal shrinkage for enhancing skin regeneration. Advanced Materials, 2021, 33: 2106175
• Liu J, Yan D, Zhang YH*. Mechanics of unusual soft network materials with rotatable structural nodes. Journal of the Mechanics and Physics of Solids, 2021, 146: 104210
• Guo X†, Ni X†, Li J†, Zhang H, Zhang F, Yu H, Wu J, Bai Y, Lei H, Huang Y, Rogers JA*, Zhang YH*. Designing mechanical metamaterials with kirigami-inspired, hierarchical constructions for giant positive and negative thermal expansion. Advanced Materials, 2021, 33: 2004919
• Bai K, Cheng X, Xue Z, Song H, Sang L, Liu F, Zhang F, Luo X, Huang W, Huang Y, Zhang YH*. Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy. Science Advances, 2020, 6: eabb7417
• Yan D†, Chang J†, Zhang H, Liu J, Song H, Xue Z, Zhang F, Zhang YH*. Soft Three Dimensional Network Materials with Rational Bio-mimetic Designs. Nature Communications, 2020, 11: 1180
• Pang W, Cheng X, Zhao H, Guo X, Ji Z, Li G, Liang Y, Xue Z, Song H, Zhang F, Xu Z, Sang L, Huang W, Li T, Zhang YH*. Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms. National Science Review, 2020, 7: 342–354
• Fan Z†, Yang Y†, Zhang F, Xu Z, Zhao H, Wang T, Song H, Huang Y*, Rogers JA*, Zhang YH*. Inverse design strategies for 3D surfaces formed by mechanically guided assembly. Advanced Materials, 2020, 32: 1908424
• Liu Y†, Wang X†, Xu Y, Xue Z, Zhang Y, Ning X, Cheng X, Xue Y, Lu D, Zhang Q, Zhang F, Liu J, Guo X, Hwang KC, Huang Y*, Rogers JA*, Zhang YH*. Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling. PNAS, 2019, 116: 15368-15377
• Luo G†, Fu H†, Cheng X, Bai K, Shi L, He X, Rogers JA, Huang Y, Zhang YH*. Mechanics of bistable cross-shaped structures through loading-path controlled 3D assembly. Journal of the Mechanics and Physics of Solids, 2019, 129: 261-277
• Cheng X, Zhang YH*. Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving and Buckling Approaches. Advanced Materials, 2019, 31: 1901895
• Fu H†, Nan K†, Bai W, Huang W, Bai K, Lu L, Zhou C, Liu YP, Liu F, Wang J, Han M, Yan Z, Luan H, Zhang YJ, Zhang YT, Zhao J, Cheng X, Li M, Lee JW, Liu Y, Fang D, Li X, Huang YG*, Zhang YH*, Rogers JA*. Morphable 3D Mesostructures and Microelectronic Devices by Multistable Buckling Mechanics. Nature Materials, 2018, 17: 268-276
• Zhang H, Guo X, Wu J, Fang DN*, Zhang YH*. Soft Mechanical Metamaterials with Unusual Swelling Behavior and Tunable Stress-strain curves. Science Advances, 2018, 4, eaar8535
• Fan Z, Hwang KC*, Rogers JA, Huang YG, Zhang YH*. A double perturbation method of postbuckling analysis in 2D curved beams for assembly of 3D ribbon-shaped structures. Journal of the Mechanics and Physics of Solids, 2018, 111: 215-238
• Zhang YH*, Zhang F, Yan Z, Ma Q, Li XL, Huang YG, Rogers JA*. Printing, Folding and assembly methods for forming 3D mesostructures in advanced materials. Nature Reviews Materials, 2017, 2: 17019
• Ma Q, Cheng H, Jang KI, Luan H, Hwang KC, Rogers JA, Huang YG, Zhang YH*. A nonlinear mechanics model of bio-inspired hierarchical lattice materials consisting of horseshoe microstructures. Journal of the Mechanics and Physics of Solids, 2016, 90: 179-202
• Xu S†, Yan Z†, Jang KI, Huang W, Fu HR, Kim JH, Wei ZJ, Flavin M, McCracken J, Wang RH, Badea A, Liu Y, Xiao DQ, Zhou GY, Lee JW, Chung HU, Cheng HY, Ren W, Banks A, Li XL, Paik U, Nuzzo RG, Huang YG*, Zhang YH*, Rogers JA*. Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling. Science, 2015, 347: 154-159
• Zhang YH†, Yan Z†, Nan KW, Xiao DQ, Liu YH, Luan HW, Fu HR, Wang XZ, Yang QL, Wang JC, Ren W, Si HZ, Liu F, Yang LH, Li HJ, Wang JT, Guo XL, Luo HY, Wang L, Huang YG*, Rogers JA*. A mechanically driven form of Kirigami as a route to 3D mesostructures in micro/nanomembranes. PNAS, 2015, 112: 11757–11764